Download PDF by Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech: Advanced Interconnects for ULSI Technology

By Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech

discovering new fabrics for copper/low-k interconnects is important to the continued improvement of desktop chips. whereas copper/low-k interconnects have served good, taking into account the construction of extremely huge Scale Integration (ULSI) units which mix over 1000000000 transistors onto a unmarried chip, the elevated resistance and RC-delay on the smaller scale has turn into a major factor affecting chip functionality.

Advanced Interconnects for ULSI Technology is devoted to the fabrics and strategies that can be compatible replacements. It covers a vast diversity of issues, from actual rules to layout, fabrication, characterization, and alertness of recent fabrics for nano-interconnects, and discusses:

  • Interconnect services, characterisations, electric homes and wiring requirements
  • Low-k fabrics: basics, advances and mechanical  properties
  • Conductive layers and barriers
  • Integration and reliability together with mechanical reliability, electromigration and electric breakdown
  • New ways together with 3D, optical, instant interchip, and carbon-based interconnects

Intended for postgraduate scholars and researchers, in academia and undefined, this booklet presents a serious assessment of the allowing know-how on the middle of the long run improvement of computing device chips.

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Advanced Interconnects for ULSI Technology by Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech


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